Phoenix Contact Polyester Enclosures

Non-Metallic Enclosure Types

Characteristics of non-metallic enclosures:

NEMA 4x rating for outdoor use providing chemical resistance and protection from dust, debris, water and rain.

High insulation value, which provides insulation from cold and hot temperatures, but does not dissipate heat from inside the enclosure.

Non-conductive, meaning components cannot be grounded to the enclosure, but it still provides the same security and tamper resistance levels as metallic enclosures when properly locked.

Types of non-metallic enclosures:

Fiberglass

A thermoset polyester material reinforced with glass fibers. It is the most widely used non-metallic material in the industry. It has high impact strength and rigidity (dimensional stability), a superior working temperature range (-31˚F to 300˚F), excellent electrical properties, moisture and chemical resistance, as well as being cost effective.  

Polycarbonate

High-performance thermoplastic resin processed by injection molding or sheet extrusion. It has superior impact resistance, good rigidity (dimensional stability), an extended temperature range (-31˚F to 180˚F), excellent electrical properties, fire retention, UV stability and corrosion resistance in some acidic surroundings. It is not suitable for environments with strong alkalis and organic solvents.

ABS or ABS blends

Acrylonitrile Butadiene Styrene is a common thermoplastic polymer processed by injection molding. It has high impact resistance, but less impact resistance in cold weather compared to polycarbonate, excellent electrical properties, superior chemical and moisture resistance, but a narrower temperature range than fiberglass (-40˚F to 248˚F).

 Polyester

High-performance unfilled thermal plastic processed by injection molding. It has high impact resistance, but less impact resistance in cold weather than polycarbonate, excellent electrical properties, superior chemical and moisture resistance, but a narrower temperature range than fiberglass (-40˚F to 248˚F).